A Review of Wafer Bonding
Wafer bonding in the form of direct/fusion bonding and anodic bonding is
reviewed. Various bonding techniques and their industrial applications are overviewed. The
bonding mechanisms, the influence of surface smoothness and surface chemistry, and the
elasto-mechanics of wafer bonding are discussed. Important electrical properties of bonded
silicon/silicon and silicon dioxide/silicon dioxide interfaces are described. In the last part of
the paper examples are given on the application of wafer bonding for solving demanding
problems in research projects.
Wafer Bonding, Direct Bonding, Fusion Bonding, Anodic Bonding, Review,Mechanism, Electrical Properties, Mechanical Properties, Wafer Bonding Applications.