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Nano et Micro Technologies

1469-3399
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 ARTICLE VOL 2/1-2 - 2002  - pp.181-202
TITLE
Single-Crystal Silicon Micro-Opto-Electro-Mechanical Devices

ABSTRACT

We present in this paper, micro-opto-electro-mechanical devices made of singlecrystalline silicon (S.C.S.) along with the corresponding micro-fabrication technological processes. These micro-components are micro-lenses, vertical mirrors for optical crossconnects, and magnetically-driven optical scanners. First, micro-lenses are presented. The so-called MEMSNAS micro-fabrication process was used. It allows the realization of three-dimensional (3D) micro-objects of nearly all shapes, which was successfully applied for manufacturing silicon lens. This is a one-mask process that uses equipment, widespread in microelectronics. Then, we present self-aligned vertical mirrors and V-grooves for optical switching applications. For this purpose, we used a micro-fabrication process based on anisotropic wet etching by potassium hydroxide (KOH), optionally in combination with Deep Reactive Ion Etching (DRIE). This process lead to thin (down to 3 microns) and tall (up to 500 microns) S.C.S. vertical mirrors and V-grooves, which are naturally aligned at 45 degrees one to the other, thanks to the (100) and (110) crystalline directions in SCS. Finally, we present optical scanners with integrated piezoresistive strain gages, which provide autooscillation capabilities to these devices when combined with the integrated magnetic excitation, either magnetostrictive or galvanic using Laplace force. Furthermore, the integrated strain gages are able to selectively detect different vibration modes such as bending and torsion. This feature provided a way to implement 2D scanning functionality.

AUTEUR(S)
tarik BOUROUINA, Philippe HÉLIN, Olivier FRANÇAIS

KEYWORDS
Lens, Mirror, Switch, Scanner, MOEMS, 3D Micro-Machining, DRIE, KOH.

LANGUE DE L'ARTICLE
Anglais

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