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Nano et Micro Technologies

1469-3399
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 ARTICLE VOL 2/1-2 - 2002  - pp.271-288
TITLE
Reliability and Failure Analysis issues in MEMS

ABSTRACT

This paper discusses typical failure modes and reliability issues that are encountered in MEMS. Also some techniques that can be used to study these issues are discussed. It is shown that many tools, commonly used for the study of ICs or IC-packages, can also be applied to investigate MEMS, although sometimes with some modification or in an alternative way. Often new tools are required for MEMS, tools that are not standard for CMOS or packaging studies.

AUTEUR(S)
Ingrid DE WOLF

KEYWORDS
Reliability, Failure, Fatigue, Creep, Fracture, Stiction, Stress, Strain.

LANGUE DE L'ARTICLE
Anglais

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