Reliability and Failure Analysis issues in MEMS
This paper discusses typical failure modes and reliability issues that are
encountered in MEMS. Also some techniques that can be used to study these issues are
discussed. It is shown that many tools, commonly used for the study of ICs or IC-packages,
can also be applied to investigate MEMS, although sometimes with some modification or in
an alternative way. Often new tools are required for MEMS, tools that are not standard for
CMOS or packaging studies.
Ingrid DE WOLF
Reliability, Failure, Fatigue, Creep, Fracture, Stiction, Stress, Strain.